A1D00117010
Dip module for the application of flux or electrically conductive adhesive onto flip chip bumps or CSP balls. The module covers 3 feeder slots (30mm each). The Dip-Module can only be used on the following placement stations: SIPLACE F5 HM ex station computer software version 407.02, SIPLACE S-27 HM ex station computer software version 505.01, SIPLACE HF/D-Serie ex station computer software version 505.01. Standard 25um-75um, Spacer 10um (00378544-01).
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